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台北國際電腦展-產品資訊-IceSLEET X6-ICEBERG THERMAL INC.

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產品資訊

  • 發布日期: 2020/08/06
  • 更新日期: 2020/08/07
Computex_IceSLEET_X6.jpg

IceSLEET X6

產品特色

產品特色

Iceberg Thermal's IceSLEET X6 – Compatible with Intel & AMD, ARGB fan cpu cooler. Complete bond soldering between fin sheets, not a stacked fin array. Soldering bond creates an optimum utilization of the cooler tower for rapid heat dissipation. Pipe architecture design with wide sweeping curves to increase performance, allowing the user to overclock. Copper base fully covers the chipset. Mechanical automatic Start/Stop function creates a quiet work/play environment and reduces power consumption decreasing heat to create a more comfortable work/play experience. When the fan is in off mode it goes silent, until the PWM duty cycle reaches 21% loading. Infinite RAM clearance below the cooler fin tower allows for the necessary space to accommodate RAM modules. Artistic design shell gives your gaming pc a standout element. Tuned copper heat pipes are engineered based on the latest requirements, with a 2mm fin air gaps to achieve a constant transmission of heat away from the chipset.

產品規格

產品規格

Vivid ARGB PWM Fan with Auto Start/Stop function ●
Two Plane Balance and Fluid Dynamic Bearing with a Rigid Brass Housing to extend the Life Cycle of the fan ●
120mm 500-1850RPM, 0-36 dBA ●
Tuned 6 Heat pipes, Tower with Complete bond soldering between fin sheets ●
Infinite RAM clearance, Copper Base, and Nickel Plating for Ultimate Performance

開發年度

開發年度

2020

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